Static dissipative polyimide (B-718) withstands wave solder environments and multiple harsh washes for printed circuit board and electronic component preprocess labelling.
- Service temperature of –70 to +100 °C
Low profile, high temperature, glossy white polyimide material features a static dissipative adhesive and static dissipative release liner. Surface resistivity values in the recommended range for dissipative ESD packaging materials as defined by ANSI/ESD S541-2008.
Certifications: UL Approved; meets requirements of MIL-STD-202G, method 215K.